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1 copyright ? 2011, everlight all rights reserved. re lease date : 04.08.2011. device no: xxxxxxx www.everlight.com ehp-69 series ehp-69/gt01c-p01/tr received mass production preliminary customer design device no. : * page : * revised record rev. description release date 1 new spec 2011.04.08
datasheet ehp-69 series ehp-69/gt01c-p01/tr 2 copyright ? 2011, everlight all rights reserved. re lease date : 04.08.2011. device no: xxxxxxx www.everlight.com ehp-69 series ehp-69/gt01c-p01/tr features small & compact package and with high efficiency typical luminous flux: 100 lm @ 500ma typical color temperature: 6000 k@500ma optical efficiency@500ma : 55 lm/w esd protection (according to jedec 3b) up to 2kv moisture sensitivity level (msl) class 3 grouping parameter: total luminous flux, color coo rdinates, forward voltage. rohs compliant & pb free description encapsulating resin: silicone resin with phosphor electrodes: ag plating die attach: silver paste chip: ingan applications camera flash light /strobe light for mobile devices torch light for dv(digital video) application signal and symbol luminaries for orientation maker lights (e.g. steps, exit ways, etc.)
datasheet ehp-69 series ehp-69/gt01c-p01/tr 3 copyright ? 2011, everlight all rights reserved. re lease date : 04.08.2011. device no: xxxxxxx www.everlight.com device selection guide chip materials emitted color ingan shiny white absolute maximum ratings (ta=25 ) parameter symbol rating unit dc operating current(torch mode) (1) i f 350 ma peak pulsed forward current(pulse mode) (2) i pulse 500 ma esd resistance (jedec 3b) v b 2000 v reverse voltage v r note 3 v junction temperature t j 125 operating temperature t op -40 ~ +85 storage temperature t stg -40 ~ +100 soldering temperature t sol 260 allowable reflow cycles n/a 2 notes: 1. pulse time > 50ms, t soldering = 25 2. 1 duty Q 0.1, pulse width Q 50ms, t soldering = 25 3. ehp-69 series are not designed for reverse bias used. 4. all specification are assured by reliability tes t for 1000hr, iv degradation less than 30% 5. all reliability items are tested under good ther mal management with 1.0x1.0 cm 2 mcpcb jedec moisture sensitivity floor life soak requirements standard level time (hours) conditions time (hours) conditions 3 168 Q 30 / 60%rh 192 +5/-0 30 / 60%rh
datasheet ehp-69 series ehp-69/gt01c-p01/tr 4 copyright ? 2011, everlight all rights reserved. re lease date : 04.08.2011. device no: xxxxxxx www.everlight.com electro-optical characteristics (ta=25 ) parameter symbol min. typ. max. unit condition luminous flux (1) i v 80 100 130 lm forward voltage (2) v f 2.95 ---- 4.15 v color temperature cct 4500 ---- 7000 k if = 500ma forward voltage binning bin min. typ. max. unit condition v1 2.95 ---- 3.25 v2 3.25 ---- 3.55 v3 3.55 ---- 3.85 v4 3.85 ---- 4.15 v if = 500ma luminous flux binning bin min. typ. max. unit condition k4 80 ---- 100 k5 100 ---- 130 lm if = 500ma note. 1. brightness measurement tolerance: 10%. 2. forward voltage measurement tolerance: 0.1v. 3. 1 duty Q 0.1, pulse width Q 50ms, tsoldering = 25 4. temperature of solder pad 25
datasheet ehp-69 series ehp-69/gt01c-p01/tr 5 copyright ? 2011, everlight all rights reserved. re lease date : 04.08.2011. device no: xxxxxxx www.everlight.com white bin structure 0 .2 8 0 .3 2 0 .3 6 0 .4 0 0 .2 4 0 .2 8 0 .3 2 0 .3 6 0 .4 0 0 .4 4 0 .4 8 w 1 4 5 0 0 5 0 0 0 5 7 0 0 7 0 0 0 w 3 w 2 y x cool-white bin coordinate bin cie x cie y bin cie x cie y 0.3738 0.4378 0.3524 0.4061 0.3524 0.4061 0.3300 0.3730 0.3440 0.3420 0.3300 0.3200 w1 0.3620 0.3720 w2 0.3440 0.3420 reference range: 4500~5000k reference range: 5000~5700k bin cie x cie y 0.303 0.333 0.33 0.373 0.33 0.32 w3 0.311 0.292 reference range: 5700~7000k notes: 1. color coordinates measurement allowance : 0.01 2. color bins are defined at i f =500ma and 50ms pulse operation condition
datasheet ehp-69 series ehp-69/gt01c-p01/tr 6 copyright ? 2011, everlight all rights reserved. re lease date : 04.08.2011. device no: xxxxxxx www.everlight.com reliability data stress test stress condition stress duration reflow tsol=260 , 10sec, 6min 3 times thermal shock h 100 20min. ' 10sec. 'l 40 20min. 500 cycles temperature cycle h 100 30min. ' 5min. 'l 40 30min. 1000 cycles high temperature/humidity storage ta=85 , rh=85% 1000hours high temperature storage ta=100 1000hours low temperature storage ta=-40 1000hours room temperature operation life ta=25 , if=350ma 1000hours pulse test ta=25 , if=1000ma 100ms on / 900ms off 30000times esd human body model 2000v, interval:0.5sec 3 times *lm: brightness attenuate difference(1000hrs) 50% *vf: forward voltage difference 20%
datasheet ehp-69 series ehp-69/gt01c-p01/tr 7 copyright ? 2011, everlight all rights reserved. re lease date : 04.08.2011. device no: xxxxxxx www.everlight.com relative spectral distribution, i f =500ma forward voltage vs. forward current relative luminou s intensity vs forward current correlated color temperature (cct) vs. forward current typical electro-optical characteristics curves 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 relative luminous intenstiy wavelength(nm) 100 200 300 400 500 2.8 3.2 3.6 4.0 forward voltage(v) forward current(ma) 0 100 200 300 400 500 0.0 0.2 0.4 0.6 0.8 1.0 relative luminous intensity forward current (ma) 100 200 300 400 500 6100 6200 6300 6400 6500 corelated color temperature (k) forward current(ma) note. 1. data was tested at pulse time = 50ms 2. data was tested under superior thermal managemen t, t soldering <70 .
datasheet ehp-69 series ehp-69/gt01c-p01/tr 8 copyright ? 2011, everlight all rights reserved. re lease date : 04.08.2011. device no: xxxxxxx www.everlight.com typical representative spatial radiation pattern -80 -60 -40 -20 0 20 40 60 80 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 relative intensity degree ( 2 ? ) note. 1. 2 1/2 is the off axis angle from lamp centerline where th e luminous intensity is 1/2 of the peak value. 2. viewing angle tolerance is 10 . mechanical dimension
datasheet ehp-69 series ehp-69/gt01c-p01/tr 9 copyright ? 2011, everlight all rights reserved. re lease date : 04.08.2011. device no: xxxxxxx www.everlight.com note: tolerances unless mentioned 0.1mm. unit = mm
datasheet ehp-69 series ehp-69/gt01c-p01/tr 10 copyright ? 2011, everlight all rights reserved. re lease date : 04.08.2011. device no: xxxxxxx www.everlight.com moisture resistant packing materials label explanation cpn: customer?s production number p/n : production number qty: packing quantity cat: rank of luminous flux hue: color rank ref: rank of forward voltage lot no: lot number made in taiwan: production place reel dimensions carrier tape dimensions: loaded quantity 1000 pcs p er reel note: tolerances unless mentioned 0.1mm. unit = mm
datasheet ehp-69 series ehp-69/gt01c-p01/tr 11 copyright ? 2011, everlight all rights reserved. re lease date : 04.08.2011. device no: xxxxxxx www.everlight.com moisture resistant packaging aluminum moistue-proof bag label desiccant label note: tolerances unless mentioned 0.1mm. unit = mm precautions for use 1. over-current-proof although the ehp-69 series has a conductive esd pro tection mechanism, customer must not use the device in reverse and should apply resistors fo r extra protection. otherwise, slight voltage shifts may cause significant current change resulti ng in burn out failure. 2. storage i. do not open the moisture proof bag before the devic es are ready to use. ii. before the package is opened, leds should be stored at temperatures less than 30 and humidity less than 90%. iii. leds should be used within a year. iv. after the package is opened, leds should be stored at temperatures less than 30 and humidity less than 60%. v. leds should be used within 168 hours (7 days) after the package is opened. vi. if the moisture absorbent material (silicone gel) h as faded away or leds have exceeded the storage time, baking treatment should be implemente d based on the following conditions: pre-curing at 605 for 24 hours. 3. thermal management i. for maintaining the high flux output and achiev ing reliability, ehp-69 series leds should be mounted on a metal core printed circuit board (mcpc b) or other kinds of heat sink with proper thermal connection to dissipate approximately 1w of thermal energy at 350ma operation. ii. heat dissipation or thermal conduction design is strongly recommended on mcpcb for reflow soldering purposes. label aluminum moisture-proof bag desiccant label
datasheet ehp-69 series ehp-69/gt01c-p01/tr 12 copyright ? 2011, everlight all rights reserved. re lease date : 04.08.2011. device no: xxxxxxx www.everlight.com temperature of soldering pad should be controlled under 70 iii. sufficient thermal management must be impleme nted. otherwise, the junction temperature of die may exceed over the limit at high current drivi ng conditions and the leds? lifetime may be decrease dramatically. iv. for further thermal management suggestions, please consult the everlight design guide or local representatives for assistance. v. the solder pad should be controlled below 70 o c when turn on the device, or the die junction temperature will be over the limit under large elec tronic driving and led lifetime will decrease critically. 4. proper handling to avoid contamination of materials, damage of inte rnal components, and shortening of led lifetime, do not subject leds to conditions as those listed below . tweezers pick and place nozzle for surface mount assembly. avoid directly contacting with nozzle. do not touch the resin to avoid scratching or other damage.
datasheet ehp-69 series ehp-69/gt01c-p01/tr 13 copyright ? 2011, everlight all rights reserved. re lease date : 04.08.2011. device no: xxxxxxx www.everlight.com 5. reflow soldering process a. ehp-69 series are suitable for smt process. b. curing of glue in oven according to standard operat ion flow processes. c. reflow soldering should not be done more than twice . d. in soldering process, stress on the leds during hea ting should be avoided. e. after soldering, do not warp the circuit board.

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